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Amphenol ICC (FCI) 10018783-10101TLF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Card Edge Connectors - Edgeboard Connectors | |
| Марка | ||
| Factory Lead Time | 10 Weeks | |
| Contact Plating | Gold | |
| Mounting Type | Through Hole | |
| Material - Insulation | Polyamide (PA), Nylon, Glass Filled | |
| Contact Materials | Copper Alloy | |
| Operating Temperature | -55°C~85°C | |
| Packaging | Tray | |
| Series | HPCE® | |
| Published | 2008 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Solder, Staggered | |
| Number of Positions | 64Positions | |
| Color | Black | |
| Number of Rows | 2Rows |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Gender | Female | |
| Contact Type | Cantilever | |
| Pitch | 0.039 1.00mm | |
| Current Rating | 1.1A | |
| Contact Finish | Gold | |
| Lead Pitch | 2.54mm | |
| Number of Contacts | 64Contacts | |
| Housing Color | Black | |
| Card Type | PCI Express™ | |
| Read Out | Dual | |
| Insulation Resistance | 1GOhm | |
| Number of Positions/Bay/Row | 11; 21 | |
| Features | Board Guide, Locking Ramp | |
| Contact Finish Thickness | 15.0μin 0.38μm | |
| Card Thickness | 0.062 1.57mm | |
| RoHS Status | RoHS Compliant | |
| Lead Free | Lead Free |