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- 10018783-11121TLF
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10018783-11121TLF Технические параметры
Amphenol ICC (FCI) 10018783-11121TLF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Card Edge Connectors - Edgeboard Connectors | |
| Марка | ||
| Factory Lead Time | 12 Weeks | |
| Contact Plating | Gold, Tin | |
| Mount | Through Hole | |
| Mounting Type | Through Hole | |
| Housing Material | Nylon | |
| Material - Insulation | Polyamide (PA), Nylon, Glass Filled | |
| Contact Materials | Copper Alloy | |
| Operating Temperature | -55°C~85°C | |
| Packaging | Tray | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Solder, Staggered | |
| Connector Type | Cantilever | |
| Number of Positions | 64Positions |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Max Operating Temperature | 85°C | |
| Min Operating Temperature | -55°C | |
| Color | Black | |
| Number of Rows | 2Rows | |
| Gender | Female | |
| Contact Type | Cantilever | |
| Pitch | 0.039 1.00mm | |
| Orientation | Straight | |
| Contact Finish | Gold | |
| Card Type | PCI Express™ | |
| Read Out | Dual | |
| Features | Board Lock, Locking Ramp | |
| Contact Finish Thickness | 15.0μin 0.38μm | |
| Card Thickness | 0.062 1.57mm | |
| RoHS Status | RoHS Compliant |
10018783-11121TLF Документы
- PCN Design/SpecificationGXT Plating Revision 19/Nov/2013 10018783 Series Drawing Specification 06/Apr/2016
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