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10023061-10104 Технические параметры
Amphenol ICC (FCI) 10023061-10104 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory Connectors - Inline Module Sockets | |
| Марка | ||
| Factory Lead Time | 9 Weeks | |
| Contact Plating | Gold | |
| Mounting Type | Through Hole | |
| Mount | Through Hole | |
| Mounting Feature | Normal, Standard - Top | |
| Memory Types | DDR2 SDRAM | |
| Insulation Materials | Thermoplastic | |
| Published | 2011 | |
| Packaging | Tray | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Through Hole | |
| Number of Positions | 240Positions | |
| Number of Rows | 2Rows |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Pitch | 2mm | |
| Orientation | Straight | |
| Depth | 7.6mm | |
| Current Rating | 500mA | |
| Contact Finish | Gold | |
| Voltage - Rated AC | 100V | |
| Number of Contacts | 240Contacts | |
| Contact Resistance | 30mOhm | |
| Insulation Resistance | 1MOhm | |
| Connector Style | DIMM | |
| Standards | MO-237 | |
| Features | Board Guide, Latches | |
| Length | 2.67mm | |
| Contact Finish Thickness | 3.00μin 0.076μm | |
| RoHS Status | Non-RoHS Compliant |
10023061-10104 Документы
- PCN PackagingMultiple Devices 24/Jul/2015
- Datasheets10023061-10104-Areva-datasheet-11804010.pdf
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