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- 10130787-080820BLF
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10130787-080820BLF Технические параметры
Amphenol ICC (FCI) 10130787-080820BLF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Card Edge Connectors - Edgeboard Connectors | |
| Марка | ||
| Factory Lead Time | 9 Weeks | |
| Contact Plating | GXT, Gold | |
| Mount | Through Hole | |
| Mounting Type | Through Hole | |
| Number of Pins | 36Pins | |
| Material - Insulation | Thermoplastic | |
| Contact Materials | Copper Alloy | |
| Operating Temperature | -55°C~105°C | |
| Packaging | Tray | |
| Series | HPCE® | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Termination | Press-Fit | |
| Number of Positions | 36 (20 + 16 Power)Position | |
| Max Operating Temperature | 105°C | |
| Min Operating Temperature | -55°C | |
| Color | Black | |
| Number of Rows | 2Rows | |
| Gender | Female | |
| Contact Finish | Gold or Gold, GXT™ | |
| Card Type | Non Specified - Dual Edge | |
| Read Out | Dual | |
| Number of Positions/Bay/Row | 8; 10 | |
| Features | Board Lock | |
| Card Thickness | 0.062 1.57mm | |
| RoHS Status | RoHS Compliant |
10130787-080820BLF Документы
- PCN Design/SpecificationHPCE/PEC Printing Removal 21/Jul/2015
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