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59355-152TSLF Технические параметры
Amphenol ICC (FCI) 59355-152TSLF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory Connectors - Inline Module Sockets | |
| Марка | ||
| Factory Lead Time | 8 Weeks | |
| Contact Plating | Gold | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount, Right Angle | |
| Mounting Feature | Reverse | |
| Contact Materials | Bronze | |
| Insulation Materials | Polymer | |
| Memory Types | DDR SDRAM | |
| Packaging | Tray | |
| Published | 2008 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Solder | |
| Number of Positions | 200Positions | |
| Max Operating Temperature | 85°C |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Min Operating Temperature | -55°C | |
| Number of Rows | 2Rows | |
| Gender | Female | |
| Pitch | 600μm | |
| Orientation | Right Angle | |
| Depth | 25.2mm | |
| Contact Finish | Gold | |
| Voltage - Rated AC | 50V | |
| Number of Contacts | 200Contacts | |
| Contact Resistance | 30mOhm | |
| Insulation Resistance | 100MOhm | |
| Connector Style | SODIMM | |
| Length | 72.2mm | |
| Contact Finish Thickness | 11.8μin 0.30μm | |
| Radiation Hardening | No | |
| RoHS Status | RoHS Compliant |
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