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68001-108HLF Технические параметры
Amphenol ICC (FCI) 68001-108HLF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Rectangular Connectors - Headers, Male Pins | |
| Марка | ||
| Factory Lead Time | 8 Weeks | |
| Contact Plating | Gold | |
| Mount | Through Hole | |
| Mounting Type | Through Hole | |
| Contact Shape | Square | |
| Housing Material | Thermoplastic | |
| Contact Finish Mating | Gold or Gold, GXT™ | |
| Contact Length-Mating | 0.230 5.84mm | |
| Contact Materials | Phosphor Bronze | |
| Voltage Rated | 1.5kV | |
| Packaging | Bulk | |
| Series | BERGSTIK® II | |
| Published | 2014 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Solder | |
| Connector Type | Header | |
| Number of Positions | 8Positions | |
| Max Operating Temperature | 125°C | |
| Min Operating Temperature | -65°C | |
| Color | Black | |
| Number of Rows | 1Row | |
| Gender | Male | |
| Fastening Type | Push-Pull |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Contact Type | Male Pin | |
| Pitch | 2.54mm | |
| Orientation | Straight | |
| Depth | 2.41mm | |
| Insulation Height | 0.100 2.54mm | |
| Style | Board to Board | |
| Number of Positions Loaded | All | |
| Current Rating | 3A | |
| Pitch - Mating | 0.100 2.54mm | |
| Insulation Color | Black | |
| Contact Length - Post | 0.120 3.05mm | |
| Shrouding | Unshrouded | |
| Number of Contacts | 8Contacts | |
| Contact Gender | Male | |
| Housing Color | Black | |
| Lead Length | 3.05mm | |
| Overall Contact Length | 0.450 11.43mm | |
| Insulation Resistance | 5GOhm | |
| Max Voltage Rating (AC) | 1.5kV | |
| Mating Post Length | 5.84mm | |
| Length | 20.32mm | |
| Contact Finish Thickness - Mating | 30.0μin 0.76μm | |
| Material Flammability Rating | UL94 V-0 | |
| Radiation Hardening | No | |
| RoHS Status | RoHS Compliant | |
| Flammability Rating | UL94 V-0 |
68001-108HLF Документы
- PCN Design/SpecificationBergStik Material 10/Mar/2010
- PCN Assembly/OriginMultiple Devices Location Change 15/Jan/2016
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