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7312S0825X01LF Технические параметры
Amphenol ICC (FCI) 7312S0825X01LF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory Connectors - PC Card Sockets | |
| Марка | ||
| Factory Lead Time | 10 Weeks | |
| Contact Plating | Gold | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount, Right Angle | |
| Mounting Feature | Normal, Standard - Top | |
| Housing Material | Thermoplastic | |
| Voltage Rated | 1kV | |
| Packaging | Tray | |
| Series | S | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | SMD/SMT | |
| ECCN Code | EAR99 | |
| Connector Type | Connector and Ejector | |
| Number of Positions | 8Positions | |
| Max Operating Temperature | 90°C |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Min Operating Temperature | -40°C | |
| Number of Rows | 2Rows | |
| MIL Conformance | NO | |
| DIN Conformance | NO | |
| IEC Conformance | NO | |
| Pitch | 2.54mm | |
| Orientation | Straight | |
| Depth | 30mm | |
| Current Rating | 1A | |
| Contact Finish | Gold-Palladium | |
| Card Type | SIM Card | |
| Insulation Resistance | 1GOhm | |
| Body/Shell Style | PLUG | |
| Insertion, Removal Method | Hinged Lid | |
| Features | Board Guide | |
| Length | 20mm | |
| Height Above Board | 0.118 3.00mm | |
| RoHS Status | RoHS Compliant | |
| Flammability Rating | UL94 V-0 |
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