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93289-105LF Технические параметры
Amphenol ICC (FCI) 93289-105LF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Rectangular Connectors - Headers, Male Pins | |
| Марка | ||
| Contact Plating | GXT, Gold | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Contact Shape | Square | |
| Housing Material | Thermoplastic | |
| Contact Finish Mating | Gold or Gold, GXT™ | |
| Contact Length-Mating | 0.130 3.30mm | |
| Insulation Materials | Thermoplastic, Glass Filled | |
| Operating Temperature | -55°C~130°C | |
| Packaging | Tube | |
| Series | Rib-Cage™ III | |
| Published | 2008 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Solder | |
| Connector Type | Header | |
| Number of Positions | 10Positions | |
| Max Operating Temperature | 130°C | |
| Min Operating Temperature | -55°C | |
| Color | Natural | |
| Number of Rows | 2Rows | |
| Fastening Type | Push-Pull |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Contact Type | Male Pin | |
| Pitch | 1.27mm | |
| Orientation | Straight | |
| Depth | 5.71mm | |
| Insulation Height | 0.298 7.57mm | |
| Style | Board to Board | |
| Number of Positions Loaded | All | |
| Pitch - Mating | 0.050 1.27mm | |
| Insulation Color | Natural | |
| Row Spacing - Mating | 0.050 (1.27mm) | |
| Shrouding | Shrouded - 4 Wall | |
| Number of Contacts | 10Contacts | |
| Contact Finish - Post | Tin | |
| Housing Color | Natural | |
| Contact Resistance | 25mOhm | |
| Max Voltage Rating (AC) | 800V | |
| Features | Board Guide | |
| Length | 9.45mm | |
| Contact Finish Thickness - Mating | 30.0μin 0.76μm | |
| Contact Finish Thickness - Post | 100.0μin 2.54μm | |
| Stack Height (Mating) | 8.26mm | |
| Material Flammability Rating | UL94 V-0 | |
| Radiation Hardening | No | |
| RoHS Status | RoHS Compliant |
93289-105LF Документы
- PCN Design/SpecificationHousing Color 20/Sept/2008
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