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- DBM13W3S300N
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DBM13W3S300N Технические параметры
Amphenol ICC (FCI) DBM13W3S300N technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | D-Sub Connectors | |
| Марка | ||
| Factory Lead Time | 18 Weeks | |
| Mount | Through Hole | |
| Mounting Type | Through Hole | |
| Dielectric Material | Thermoplastic | |
| Housing Material | Steel | |
| Shell Material, Finish | Steel, Yellow Cadmium Plated | |
| Contact Materials | Phosphor Bronze | |
| Voltage Rated | 300V | |
| Operating Temperature | -55°C~125°C | |
| Packaging | Tray | |
| Series | DMW HE507 | |
| JESD-609 Code | e4 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 10Terminations | |
| Termination | Solder | |
| ECCN Code | EAR99 | |
| Connector Type | Receptacle, Female Sockets | |
| Number of Positions | 13 (10 + 3 Power)Position | |
| Number of Rows | 2Rows | |
| Gender | Male | |
| HTS Code | 8536.69.40.30 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| MIL Conformance | NO | |
| DIN Conformance | NO | |
| IEC Conformance | NO | |
| Filter Feature | NO | |
| Contact Type | Signal and Power (Not Included) | |
| Mixed Contacts | YES | |
| Option | GENERAL PURPOSE | |
| Pitch | 6.86mm | |
| Total Number of Contacts | 13Contacts | |
| Orientation | Straight | |
| Depth | 12.55mm | |
| Current Rating | 7.5A | |
| Contact Finish | Gold | |
| UL Flammability Code | 94V-0 | |
| Empty Shell | NO | |
| Flange Feature | Housing/Shell (Unthreaded) | |
| Plating | Cadmium | |
| Connector Style | D-Sub, Combo | |
| Number of Ports | 1Port | |
| Shell Size, Connector Layout | 3 DB B - 13C3 13W3 | |
| Height | 11.93mm | |
| Length | 52.65mm | |
| Material Flammability Rating | UL94 V-0 | |
| RoHS Status | Non-RoHS Compliant |
DBM13W3S300N Документы
- DatasheetsDBM13W3S300N-Areva-datasheet-11967360.pdf
- PCN Design/SpecificationMultiple Devices Plating 05/Mar/2018 Multiple Devices Plating Revision 18/Jul/2018
- PCN Assembly/OriginMultiple Devices Location 08/Mar/2017
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