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DILB8P-223TLF Технические параметры
Amphenol ICC (FCI) DILB8P-223TLF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Sockets for ICs, Transistors | |
| Марка | ||
| Factory Lead Time | 11 Weeks | |
| Contact Plating | Tin | |
| Mounting Type | Through Hole | |
| Housing Material | Polyamide (PA), Nylon | |
| Number of Positions or Pins (Grid) | 8 (2 x 4) | |
| Contact Material - Mating | Copper Alloy | |
| Contact Material - Post | Copper Alloy | |
| Contact Finish Mating | Tin | |
| Operating Temperature | -55°C~105°C | |
| Packaging | Tube | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Termination | Solder | |
| Type | DIP, 0.3 (7.62mm) Row Spacing | |
| Current Rating (Amps) | 1A | |
| Pitch - Mating | 0.100 2.54mm | |
| Number of Contacts | 8Contacts | |
| Contact Finish - Post | Tin | |
| Contact Resistance | 30mOhm | |
| Termination Post Length | 0.124 3.15mm | |
| Pitch - Post | 0.100 2.54mm | |
| Features | Open Frame | |
| Contact Finish Thickness - Mating | 100.0μin 2.54μm | |
| Contact Finish Thickness - Post | 100.0μin 2.54μm | |
| Material Flammability Rating | UL94 V-0 | |
| RoHS Status | RoHS Compliant |
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