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DIP624-011BLF Технические параметры

Amphenol ICC (FCI)  DIP624-011BLF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Sockets for ICs, Transistors
Марка
Mount Through Hole
Mounting Type Through Hole
Number of Pins 24Pins
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Number of Positions or Pins (Grid) 24 (2 x 12)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass
Contact Finish Mating Gold
Contact Materials Copper
Packaging Tube
Published 2007
JESD-609 Code e3
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.6 (15.24mm) Row Spacing
HTS Code 8536.69.40.40
Terminal Pitch 2.54mm
Свойство продукта Значение свойства
Pitch - Mating 0.100 2.54mm
Number of Contacts 24Contacts
Contact Finish - Post Tin
PCB Contact Pattern RECTANGULAR
Body Breadth 0.7 inch
Lead Length 3.175mm
Body Depth 0.165 inch
Contact Style RND PIN-SKT
Mating Contact Pitch 0.1 inch
PCB Contact Row Spacing 0.6 mm
Termination Post Length 0.125 3.18mm
Pitch - Post 0.100 2.54mm
Features Open Frame
Height 4.19mm
Length 30.5mm
Width 17.8mm
Contact Finish Thickness - Mating 10.0μin 0.25μm
Contact Finish Thickness - Post 200.0μin 5.08μm
Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0

DIP624-011BLF Документы

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