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HM2P80PCF1G1N9 Технические параметры
Amphenol ICC (FCI) HM2P80PCF1G1N9 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Backplane Connectors - Hard Metric, Standard | |
| Марка | ||
| Contact Plating | Gold | |
| Mount | Through Hole | |
| Mounting Type | Through Hole | |
| Housing Material | Thermoplastic | |
| Contact Materials | Bronze | |
| Voltage Rated | 750Vrms | |
| Operating Temperature | -55°C~125°C | |
| Packaging | Tray | |
| Series | Millipacs® | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Press-Fit | |
| Connector Type | Header, Male Pins |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Number of Positions | 77 (55 + 22 Ground)Position | |
| Max Operating Temperature | 125°C | |
| Min Operating Temperature | -55°C | |
| Number of Rows | 5 + 2Row | |
| Current Rating (Amps) | 1.5A | |
| Pitch | 0.079 2.00mm | |
| Number of Positions Loaded | All | |
| Current Rating | 1.5A | |
| Contact Finish | Gold | |
| Insulation Resistance | 10GOhm | |
| Connector Style | CR 11 | |
| Features | Board Guide | |
| Contact Finish Thickness | 30.0μin 0.76μm | |
| RoHS Status | Non-RoHS Compliant | |
| Flammability Rating | UL94 V-0 |
HM2P80PCF1G1N9 Документы
- PCN Obsolescence/ EOLHM2 Millipacs 16/Feb/2011 Multiple Devices 07/Oct/2016
- PCN Design/SpecificationHM2 Plating 20/Sept/2012 HM2 Series Copper Alloy 22/Jun/2013
- PCN PackagingMillipacs UL/CSA marking 01/July/2009 Millipacs Devices 16/Dec/2010
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