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- Backplane Connectors - Hard Metric, Standard
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- HM2R89PA8108N9LF
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HM2R89PA8108N9LF Технические параметры
Amphenol ICC (FCI) HM2R89PA8108N9LF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Backplane Connectors - Hard Metric, Standard | |
| Марка | ||
| Factory Lead Time | 10 Weeks | |
| Contact Plating | Gold | |
| Mount | Through Hole | |
| Mounting Type | Board Edge, Through Hole, Right Angle | |
| Housing Material | Thermoplastic | |
| Contact Materials | Bronze | |
| Voltage Rated | 500V | |
| Operating Temperature | -55°C~125°C | |
| Packaging | Tray | |
| Series | Millipacs® | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Press-Fit | |
| Connector Type | Receptacle, Female Sockets | |
| Number of Positions | 99 (88 + 11 Ground)Position |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Max Operating Temperature | 125°C | |
| Min Operating Temperature | -55°C | |
| Number of Rows | 8 + 1Row | |
| Current Rating (Amps) | 1.5A | |
| Pitch | 0.079 2.00mm | |
| Number of Positions Loaded | All | |
| Current Rating | 1.5A | |
| Contact Finish | Gold | |
| Number of Contacts | 88Contacts | |
| Insulation Resistance | 10GOhm | |
| Connector Style | F 11 | |
| Features | Board Guide, Shielded | |
| Contact Finish Thickness | 30.0μin 0.76μm | |
| Radiation Hardening | No | |
| RoHS Status | RoHS Compliant | |
| Flammability Rating | UL94 V-0 |
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