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- SFV26R-1STE9HLF
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SFV26R-1STE9HLF Технические параметры
Amphenol ICC (FCI) SFV26R-1STE9HLF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | FFC, FPC (Flat Flexible) Connectors | |
| Марка | ||
| Factory Lead Time | 14 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount, Right Angle | |
| Housing Material | Liquid Crystal Polymer (LCP), Glass Filled, Halogen Free | |
| Actuator Material | Polyphenylene Sulfide (PPS), Glass Filled, Halogen Free | |
| Contact Materials | Phosphor Bronze | |
| Voltage Rated | 50V | |
| Operating Temperature | -55°C~105°C | |
| Packaging | Tape & Reel (TR) | |
| Series | SFV-R | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Solder | |
| Connector Type | FFC/FPC CONNECTOR | |
| Number of Positions | 26Positions | |
| Number of Rows | 1Row | |
| Gender | Receptacle | |
| MIL Conformance | NO | |
| DIN Conformance | NO | |
| IEC Conformance | NO |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Filter Feature | NO | |
| Mixed Contacts | NO | |
| Option | GENERAL PURPOSE | |
| Current Rating (Amps) | 0.5A | |
| Pitch | 0.020 0.50mm | |
| Total Number of Contacts | 26Contacts | |
| Current Rating | 500mA | |
| Contact Finish | Tin | |
| UL Flammability Code | 94V-0 | |
| Housing Color | Black | |
| Wire/Cable Type | Straight | |
| Mating Cycles | 20 | |
| Flat Flex Type | FFC, FPC | |
| Cable End Type | Straight, Tapered | |
| Locking Feature | Slide Lock | |
| Features | Solder Retention, Zero Insertion Force (ZIF) | |
| Height Above Board | 0.071 1.80mm | |
| FFC, FCB Thickness | 0.30mm 0.33mm | |
| Material Flammability Rating | UL94 V-0 | |
| REACH SVHC | No SVHC | |
| RoHS Status | RoHS Compliant | |
| Flammability Rating | UL94 V-0 |
SFV26R-1STE9HLF Документы
- PCN Assembly/OriginSFV_R Series Assembly Machine 20/Mar/2019
- PCN PackagingMultiple Devices Packaging Material 31/Jan/2019 Multiple Devices Package Material Revision 25/Feb/2019
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