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Analog Devices 1701177 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
Свойство продукта | Значение свойства | |
---|---|---|
Классификация | Terminal Blocks - Wire to Board | |
Марка | ||
Mounting Type | Through Hole, Right Angle | |
Contact Shape | Square | |
Voltage, Rating | -- | |
Mated Stacking Heights | -- | |
Contact Materials | Copper Alloy | |
Contact Finish Mating | Gold | |
Insulation Materials | Thermoplastic | |
Contact Length-Mating | 0.318 (8.08mm) | |
Operating Temperature | -65°C ~ 105°C | |
Series | AMPMODU Mod II | |
Packaging | Bulk | |
Part Status | Discontinued at Digi-Key | |
Termination | Solder | |
Connector Type | Header, Breakaway | |
Number of Positions | 10Positions | |
Applications | -- | |
Number of Rows | 1Row |
Свойство продукта | Значение свойства | |
---|---|---|
Fastening Type | Push-Pull | |
Contact Type | Male Pin | |
Ingress Protection | -- | |
Insulation Height | 0.138 (3.50mm) | |
Style | Board to Board or Cable | |
Number of Positions Loaded | All | |
Current Rating | 3A | |
Pitch - Mating | 0.100 (2.54mm) | |
Insulation Color | Black | |
Row Spacing - Mating | -- | |
Contact Length - Post | 0.110 (2.79mm) | |
Shrouding | Unshrouded | |
Contact Finish - Post | Tin-Lead | |
Overall Contact Length | -- | |
Features | -- | |
Contact Finish Thickness - Mating | 30.0µin (0.76µm) | |
Contact Finish Thickness - Post | 100.0µin (2.54µm) | |
Material Flammability Rating | UL94 V-0 |