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DS3174N Технические параметры
Analog Devices DS3174N technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Interface - Telecom | |
| Марка | ||
| Mounting Type | Through Hole | |
| Package / Case | 400-BBGA | |
| Supplier Device Package | 400-PBGA (27x27) | |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled | |
| Number of Positions or Pins (Grid) | 24 (2 x 12) | |
| Contact Material - Mating | Beryllium Copper | |
| Contact Material - Post | Brass | |
| Contact Finish Mating | Gold | |
| Package | Tray | |
| Base Product Number | DS3174 | |
| Mfr | Analog Devices Inc./Maxim Integrated | |
| Product Status | Obsolete | |
| Operating Temperature | -55°C ~ 125°C | |
| Series | EJECT-A-DIP™ | |
| Packaging | Bulk | |
| Part Status | Active |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Termination | Wire Wrap | |
| Type | DIP, 0.6 (15.24mm) Row Spacing | |
| Voltage - Supply | 3.135V ~ 3.465V | |
| Current Rating | 3A | |
| Pitch - Mating | 0.100 (2.54mm) | |
| Function | Single-Chip Transceiver | |
| Contact Finish - Post | Gold | |
| Contact Resistance | -- | |
| Interface | DS3, E3 | |
| Number of Circuits | 4Circuits | |
| Current - Supply | 725mA | |
| Termination Post Length | 0.040 (1.02mm) | |
| Pitch - Post | 0.100 (2.54mm) | |
| Features | Closed Frame | |
| Contact Finish Thickness - Mating | 10.0µin (0.25µm) | |
| Contact Finish Thickness - Post | 10.0µin (0.25µm) | |
| Material Flammability Rating | UL94 V-0 |
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