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L063C152 Технические параметры
BI Technologies L063C152 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Chip Resistor - Surface Mount | |
| Марка | BI Technologies | |
| Surface Mount | NO | |
| Terminal Shape | FLAT | |
| Mounting Feature | THROUGH HOLE MOUNT | |
| Number of Terminals | 6Terminals | |
| RoHS | Non-Compliant | |
| Package Width | 2.41 mm | |
| Risk Rank | 5.84 | |
| Package Length | 15.24 mm | |
| Ihs Manufacturer | BI TECHNOLOGIES CORP | |
| Part Life Cycle Code | Obsolete | |
| Package Height | 4.95 mm | |
| Number of Elements | 1 Element | |
| Manufacturer | TT electronics / BI Technologies | |
| Package Shape | RECTANGULAR PACKAGE | |
| Manufacturer Part Number | L063C152 | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Style | SIP | |
| Package Description | SIP, |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Tolerance | 2% | |
| JESD-609 Code | e0 | |
| ECCN Code | EAR99 | |
| Temperature Coefficient | 100 ppm/°C | |
| Resistance | 1500 Ω | |
| Terminal Finish | TIN LEAD | |
| HTS Code | 8533.21.00.50 | |
| Subcategory | Array/Network Resistors | |
| Packing Method | BULK | |
| Technology | METAL GLAZE/THICK FILM | |
| Number of Functions | 3Functions | |
| Construction | Rectangular | |
| Resistor Type | ARRAY/NETWORK RESISTOR | |
| Reach Compliance Code | unknown | |
| Rated Power Dissipation (P) | 0.6 W | |
| Working Voltage | 100 V | |
| Rated Temperature | 70 °C | |
| Element Power Dissipation | 0.2 W | |
| Network Type | ISOLATED | |
| First Element Resistance | 1500 Ω | |
| Temperature Coefficient Tracking | 50 ppm/°C |
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