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HCPL-3150-300E Технические параметры
Broadcom Limited HCPL-3150-300E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Isolators - Gate Drivers | |
| Марка | ||
| Factory Lead Time | 17 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 8-SMD, Gull Wing | |
| Number of Pins | 8Pins | |
| Collector-Emitter Breakdown Voltage | 27V | |
| Number of Elements | 1 Element | |
| Usage Level | Industrial grade | |
| Operating Temperature | -40°C~100°C | |
| Packaging | Tube | |
| Published | 2008 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| ECCN Code | EAR99 | |
| Terminal Finish | Matte Tin (Sn) | |
| Additional Feature | UL RECOGNIZED | |
| Max Power Dissipation | 295mW | |
| Approval Agency | CSA, UR | |
| Voltage - Isolation | 3750Vrms | |
| Output Voltage | 30V | |
| Max Output Current | 600mA |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Configuration | COMPLEX | |
| Number of Channels | 1Channel | |
| Voltage - Forward (Vf) (Typ) | 1.5V | |
| Propagation Delay | 300 ns | |
| Turn On Delay Time | 500 ns | |
| Optoelectronic Device Type | LOGIC IC OUTPUT OPTOCOUPLER | |
| Forward Current | 7mA | |
| Direction | Unidirectional | |
| Output Current per Channel | 600mA | |
| Rise Time | 100ns | |
| Fall Time (Typ) | 100 ns | |
| Rise / Fall Time (Typ) | 100ns 100ns | |
| Max Input Current | 16mA | |
| Current - DC Forward (If) (Max) | 25mA | |
| Input Current | 16mA | |
| Propagation Delay tpLH / tpHL (Max) | 500ns, 500ns | |
| Common Mode Transient Immunity (Min) | 15kV/μs | |
| Pulse Width Distortion (PWD) | 300 ns | |
| Voltage - Output Supply | 15V~30V | |
| Width | 9.65mm | |
| REACH SVHC | No SVHC | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
HCPL-3150-300E Документы
- PCN Design/SpecificationMult Device Design Changes 10/Nov/2015 Molding Chg 08/Feb/2016
- PCN PackagingMultiple Devices Marking/Labeling 07/Aug/2013 Marking/Labeling Revision B 14/Jan/2014
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