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HCPL-3760-300E Технические параметры
Broadcom Limited HCPL-3760-300E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Optoisolators - Transistor, Photovoltaic Output | |
| Марка | ||
| Factory Lead Time | 17 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 8-SMD, Gull Wing | |
| Number of Pins | 8Pins | |
| Number of Elements | 1 Element | |
| Operating Temperature | -40°C~85°C | |
| Packaging | Tube | |
| Published | 2009 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| ECCN Code | EAR99 | |
| Additional Feature | CMOS COMPATIBLE, UL RECOGNIZED | |
| Max Power Dissipation | 305mW | |
| Supply Voltage | 18V | |
| Frequency | 4kHz | |
| Voltage - Isolation | 3750Vrms | |
| Output Voltage | 20V | |
| Output Type | Darlington | |
| Max Output Current | 30mA | |
| Supply Voltage-Min (Vsup) | 2V |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Configuration | SINGLE | |
| Number of Channels | 1Channel | |
| Power Dissipation | 305mW | |
| Output Current | 30mA | |
| Input Type | AC, DC | |
| Optoelectronic Device Type | LOGIC IC OUTPUT OPTOCOUPLER | |
| Forward Current | 50mA | |
| Max Output Voltage | 20V | |
| Response Time | 0.00004 ns | |
| Data Rate | 4 kbps | |
| Output Current per Channel | 30mA | |
| Rise Time | 14ns | |
| Fall Time (Typ) | 400 ns | |
| Max Collector Current | 30mA | |
| Rise / Fall Time (Typ) | 14μs 0.4μs | |
| Max Input Current | 50mA | |
| Input Current | 2.2mA | |
| On-State Current-Max | 0.03A | |
| Turn On / Turn Off Time (Typ) | 4.5μs, 8μs | |
| Width | 9.65mm | |
| REACH SVHC | No SVHC | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
HCPL-3760-300E Документы
- PCN Design/SpecificationMult Device Design Changes 10/Nov/2015 Molding Chg 08/Feb/2016
- PCN PackagingMultiple Devices Marking/Labeling 07/Aug/2013 Marking/Labeling Revision B 14/Jan/2014
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