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HCPL-4100-000E Технические параметры
Broadcom Limited HCPL-4100-000E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Special Purpose | |
| Марка | ||
| Factory Lead Time | 22 Weeks | |
| Contact Plating | Tin | |
| Mount | Through Hole | |
| Mounting Type | Through Hole | |
| Package / Case | 8-DIP (0.300, 7.62mm) | |
| Number of Pins | 8Pins | |
| Collector-Emitter Breakdown Voltage | 27V | |
| Number of Elements | 1 Element | |
| Operating Temperature | -40°C~85°C | |
| Packaging | Tube | |
| Published | 2010 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| ECCN Code | EAR99 | |
| Type | Current Loop Transmitter | |
| Additional Feature | TTL COMPATIBLE, UL RECOGNIZED | |
| Max Power Dissipation | 360mW | |
| Voltage - Supply | 4.5V~20V | |
| Supply Voltage | 5V | |
| Approval Agency | CSA, UR | |
| Voltage - Isolation | 3750Vrms | |
| Output Voltage | 27V | |
| Max Output Current | 30mA |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Configuration | SINGLE | |
| Number of Channels | 1Channel | |
| Power Dissipation | 360mW | |
| Output Current | 30mA | |
| Propagation Delay | 1 μs | |
| Input Type | Logic | |
| Turn On Delay Time | 500 ns | |
| Response Time | 1.6e-8 ns | |
| Data Rate | 24 kbps | |
| Direction | Unidirectional | |
| Output Current per Channel | 30mA | |
| Rise Time | 16ns | |
| Forward Voltage | 20V | |
| Fall Time (Typ) | 23 ns | |
| Rise / Fall Time (Typ) | 16ns 23ns | |
| Forward Current-Max | 0.00032A | |
| Max Input Current | 250μA | |
| Input Current | 13mA | |
| On-State Current-Max | 0.024A | |
| Propagation Delay tpLH / tpHL (Max) | 1.6μs, 1μs | |
| Common Mode Transient Immunity (Min) | 1kV/μs | |
| REACH SVHC | No SVHC | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
HCPL-4100-000E Документы
- PCN Design/SpecificationMult Device Design Changes 10/Nov/2015 Molding Chg 08/Feb/2016
- PCN PackagingMultiple Devices Marking/Labeling 07/Aug/2013 Marking/Labeling Revision B 14/Jan/2014
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