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HSMP-4820-BLKG Технические параметры
Broadcom Limited HSMP-4820-BLKG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Diodes - RF | |
| Марка | ||
| Factory Lead Time | 6 Weeks | |
| Mount | Surface Mount | |
| Package / Case | TO-236-3, SC-59, SOT-23-3 | |
| Number of Pins | 3Pins | |
| Diode Element Material | SILICON | |
| Breakdown Voltage / V | 50V | |
| Number of Elements | 1 Element | |
| Operating Temperature | 150°C TJ | |
| Packaging | Strip | |
| Published | 2005 | |
| JESD-609 Code | e4 | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 3Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Applications | LIMITER; SWITCHING | |
| Additional Feature | LOW DISTORTION | |
| HTS Code | 8541.10.00.80 | |
| Voltage - Rated DC | 50V | |
| Max Power Dissipation | 250mW | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Peak Reflow Temperature (Cel) | 260 | |
| Current Rating | 1A | |
| Base Part Number | HSMP-4820 | |
| Max Current Rating | 1A | |
| Element Configuration | Common Anode | |
| Diode Type | PIN - Single | |
| Power Dissipation | 250mW | |
| Output Current | 1A | |
| Forward Current | 1A | |
| Capacitance @ Vr, F | 0.75pF @ 20V 1MHz | |
| Reverse Voltage | 50V | |
| Reverse Voltage (DC) | 20V | |
| Frequency Band | L B | |
| Diode Capacitance-Nom | 0.75pF | |
| Resistance @ If, F | 600mOhm @ 10mA 1MHz | |
| Diode Capacitance-Max | 1pF | |
| Diode Res Test Current | 10mA | |
| Diode Forward Resistance-Max | 0.6Ohm | |
| Height | 1.2mm | |
| Length | 3.13mm | |
| Width | 1.5mm | |
| REACH SVHC | No SVHC | |
| Radiation Hardening | No | |
| RoHS Status | RoHS Compliant | |
| Lead Free | Lead Free |
HSMP-4820-BLKG Документы
- PCN Obsolescence/ EOLMult Devices EOL 01/Dec/2017
- PCN Assembly/OriginMult Device Tape Cover Chg 18/Sep/2017
- PCN PackagingMult Devices Packing 25/Apr/2018
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