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EXB-SN96.5AG3.0CU0.5 Технические параметры

Chip Quik  EXB-SN96.5AG3.0CU0.5 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Solder
Марка Chip Quik
Package Bulk
Base Product Number EXB-SN96
Mfr Chip Quik Inc.
Product Status Active
Series Super Low Dross™
Type Bar Solder
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Свойство продукта Значение свойства
Wire Gauge -
Shelf Life -
Storage/Refrigeration Temperature -
Shelf Life Start -
Form Bar, 1 lb (454g)
Process Lead Free
Melting Point 423 ~ 428°F (217 ~ 220°C)
Flux Type -
Diameter -
EXB-SN96.5AG3.0CU0.5 brand manufacturers: Chip Quik, Anli stock, EXB-SN96.5AG3.0CU0.5 reference price.Chip Quik. EXB-SN96.5AG3.0CU0.5 parameters, EXB-SN96.5AG3.0CU0.5 Datasheet PDF and pin diagram description download.You can use the EXB-SN96.5AG3.0CU0.5 Solder, DSP Datesheet PDF, find EXB-SN96.5AG3.0CU0.5 pin diagram and circuit diagram and usage method of function,EXB-SN96.5AG3.0CU0.5 electronics tutorials.You can download from the Anli.