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PA0061C Технические параметры

Chip Quik, Inc.  PA0061C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Solderless Breadboards
Марка
Material FR4 Epoxy Glass
Package Accepted QFN
RoHS Details
Contact Materials Gold
Package Bulk
Base Product Number PA0061
Mfr Chip Quik Inc.
Product Status Active
Series Proto-Advantage
Свойство продукта Значение свойства
Size / Dimension 0.800 L x 0.400 W (20.32mm x 10.16mm)
Type QFN-16 to DIP-16 SMT Adapter
Number of Positions 16Positions
Pitch 0.020 (0.50mm)
Proto Board Type SMD to DIP
Product Surface Mount Adapter
Length 20.32 mm
Width 10.16 mm
Height 1.6 mm
Board Thickness 0.063 (1.60mm)
PA0061C brand manufacturers: Chip Quik, Inc., Anli stock, PA0061C reference price.Chip Quik, Inc.. PA0061C parameters, PA0061C Datasheet PDF and pin diagram description download.You can use the PA0061C Solderless Breadboards, DSP Datesheet PDF, find PA0061C pin diagram and circuit diagram and usage method of function,PA0061C electronics tutorials.You can download from the Anli.