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TS991SNL35T3 Технические параметры

Chip Quik, Inc.  TS991SNL35T3 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Solder
Марка
Weight -
RoHS Details
Alloy Sn96.5/Ag3.0/Cu0.5
Package Type Syringe
Contains Lead No
Factory Pack QuantityFactory Pack Quantity 1
Description/Function Synthetic No-Clean
Package Bulk
Mfr Chip Quik Inc.
Product Status Active
Series CHIPQUIK®
Type Paste, No Clean
Свойство продукта Значение свойства
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Wire Gauge -
Size 10cc
Shelf Life 12 Months
Storage/Refrigeration Temperature 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start Date of Manufacture
Form Syringe, 1.23 oz (34.869g)
Shipping Info -
Process -
Melting Point 423°F (217°C)
Flux Type No-Clean
Product Solder
Mesh Type 3
Diameter -
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