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TS991SNL500T4 Технические параметры

Chip Quik, Inc.  TS991SNL500T4 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Solder
Марка
RoHS Details
Alloy Sn96.5/Ag3.0/Cu0.5
Package Type Jar
Contains Lead No
Factory Pack QuantityFactory Pack Quantity 1
Description/Function Synthetic No-Clean
Package Bulk
Base Product Number TS991S
Mfr Chip Quik Inc.
Product Status Active
Series CHIPQUIK®
Свойство продукта Значение свойства
Type Paste, No Clean
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Wire Gauge -
Size 500 g
Shelf Life 12 Months
Shelf Life Start Date of Manufacture
Form Jar, 17.64 oz (500g)
Process Lead Free
Melting Point 423°F (217°C)
Flux Type No-Clean
Product Solder
Mesh Type 4
Diameter -
Просмотр сходства
TS991SNL500T4 brand manufacturers: Chip Quik, Inc., Anli stock, TS991SNL500T4 reference price.Chip Quik, Inc.. TS991SNL500T4 parameters, TS991SNL500T4 Datasheet PDF and pin diagram description download.You can use the TS991SNL500T4 Solder, DSP Datesheet PDF, find TS991SNL500T4 pin diagram and circuit diagram and usage method of function,TS991SNL500T4 electronics tutorials.You can download from the Anli.