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- CPDU5V0U-HF
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CPDU5V0U-HF Технические параметры
Comchip Technology CPDU5V0U-HF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | TVS - Diodes | |
| Марка | Comchip Technology | |
| Factory Lead Time | 8 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 2-SMD, No Lead | |
| Diode Element Material | SILICON | |
| Manufacturer Package Identifier | 0603/SOD-523F | |
| Breakdown Voltage / V | 6V | |
| Number of Elements | 1 Element | |
| Reverse Stand-off Voltage | 5V | |
| Packaging | Tape & Reel (TR) | |
| Published | 2011 | |
| JESD-609 Code | e4 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 2Terminations | |
| Termination | Solder | |
| ECCN Code | EAR99 | |
| Type | Zener | |
| Terminal Finish | Gold (Au) | |
| Max Operating Temperature | 125°C |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Min Operating Temperature | -40°C | |
| Applications | General Purpose | |
| Capacitance | 130pF | |
| Terminal Position | DUAL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| JESD-30 Code | R-PDSO-N2 | |
| Configuration | SINGLE | |
| Power Line Protection | No | |
| Current - Peak Pulse (10/1000μs) | 16A 8/20μs | |
| Voltage - Clamping (Max) @ Ipp | 12.5V | |
| Clamping Voltage | 12V | |
| Voltage - Reverse Standoff (Typ) | 5V | |
| Peak Pulse Current | 15A | |
| Peak Pulse Power | 200W | |
| Direction | Unidirectional | |
| Unidirectional Channels | 1 | |
| Rep Pk Reverse Voltage-Max | 5V | |
| Capacitance @ Frequency | 90pF @ 1MHz | |
| Max Junction Temperature (Tj) | 125°C | |
| Height | 850μm | |
| RoHS Status | ROHS3 Compliant |
CPDU5V0U-HF Документы
- DatasheetsCPDU5V0U-HF CPDU5V0U-HF-Comchip-datasheet-17018405.pdf CPDU5V0U-HF-Comchip-datasheet-38893568.pdf
- Environmental InformationComchip RoHS3 Cert
- PCN Design/SpecificationWafer Chg 11/Apr/2016
- PCN PackagingLabel D/C Chg 24/Mar/2016
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