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BSPA150240D5P Технические параметры
Cooper Bussmann BSPA150240D5P technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Circuit Breakers | |
| Марка | Cooper Bussmann | |
| Mounting Type | Through Hole | |
| Material - Insulation | Polycyclohexylenedimethylene Terephthalate (PCT) | |
| Lead Free Status / RoHS Status | -- | |
| Contact Materials | Phosphor Bronze | |
| Manufacturer Part Number | BSPA150240D5P | |
| Approvals | CSA, UL | |
| Manufacturer | Bussmann | |
| RoHS | Yes | |
| Mounting | Wall | |
| Operating Temperature | -- | |
| Series | -- | |
| Packaging | Bulk | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | -- |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Termination | Solder | |
| Number of Positions | 280Positions | |
| Color | Brown | |
| Number of Rows | 2Rows | |
| Gender | Female | |
| Contact Type | -- | |
| Pitch | 0.050 (1.27mm) | |
| Contact Finish | Gold | |
| Card Type | Non Specified - Dual Edge, Bi-Level | |
| Read Out | Dual | |
| Number of Positions/Bay/Row | -- | |
| Flange Feature | -- | |
| Features | Bi-Level - High Density, Board Lock | |
| Contact Finish Thickness | 30.0µin (0.76µm) | |
| Card Thickness | 0.054 ~ 0.070 (1.37mm ~ 1.78mm) |
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