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APF19-19-13CB/A01 Технические параметры

CTS  APF19-19-13CB/A01 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Thermal - Heat Sinks
Марка CTS
Body Material ALUMINUM 6063
Product Depth (mm) 19(mm)
Device Cooled BGA
Product Diameter (mm) Not Required(mm)
Rad Hardened No
Fin Style FORGED
Mounting Styles Adhesive
Heatsink Material Aluminum
Designed for BGA, PGA, PLCC, QFP
Свойство продукта Значение свойства
Type Passive
Attachment Method Adhesive Tape
Finish Black Anodized
Product Heatsinks
Thermal Resistance 4.4°C/W@200LFPM
Product Length (mm) 19(mm)
Width 19 mm
Height 12.7 mm
Length 19 mm
Product Height (mm) 12.7(mm)
Просмотр сходства
APF19-19-13CB/A01 brand manufacturers: CTS, Anli stock, APF19-19-13CB/A01 reference price.CTS. APF19-19-13CB/A01 parameters, APF19-19-13CB/A01 Datasheet PDF and pin diagram description download.You can use the APF19-19-13CB/A01 Thermal - Heat Sinks, DSP Datesheet PDF, find APF19-19-13CB/A01 pin diagram and circuit diagram and usage method of function,APF19-19-13CB/A01 electronics tutorials.You can download from the Anli.