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- APF30-30-13CB/A01
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APF30-30-13CB/A01 Технические параметры
CTS APF30-30-13CB/A01 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Thermal - Heat Sinks | |
| Марка | CTS | |
| Body Material | ALUMINUM 6063 | |
| Product Depth (mm) | 30(mm) | |
| Device Cooled | BGA | |
| Product Diameter (mm) | Not Required(mm) | |
| Rad Hardened | No | |
| Fin Style | FORGED | |
| Mounting Styles | Adhesive | |
| Heatsink Material | Aluminum | |
| Designed for | BGA, PGA, PLCC, QFP | |
| Temperature Coefficient | 100 ppm/K | |
| Type | Passive | |
| Resistance | 215 kOhm |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Power Rating | 0.0625 W | |
| Resistor Type | General Purpose | |
| Attachment Method | Adhesive Tape | |
| Resistance Tolerance | 1 | |
| Finish | Black Anodized | |
| Product | Heatsinks | |
| Product Length | 30 mm | |
| Thermal Resistance | 2.5 °C/W | |
| Product Length (mm) | 30(mm) | |
| Width | 30 mm | |
| Height | 12.7 mm | |
| Length | 30 mm | |
| Product Height (mm) | 12.7(mm) |
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