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BDN16-3CB/A01 Технические параметры

CTS Thermal Management Products  BDN16-3CB/A01 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Thermal - Heat Sinks
Марка
Factory Lead Time 14 Weeks
Material Aluminum
Shape Square, Pin Fins
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Material Finish Black Anodized
Series BDN
Published 2007
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Top Mount
Свойство продукта Значение свойства
Construction EXTRUDED
Attachment Method Thermal Tape, Adhesive (Included)
Height Off Base (Height of Fin) 0.355 9.02mm
Thermal Resistance @ Forced Air Flow 4.50°C/W @ 400 LFM
Thermal Resistance @ Natural 13.50°C/W
Profile PIN FIN ARRAY
Fin Orientation OMNIDIRECT
Device Used On IC
Length 1.610 40.89mm
Width 1.610 40.89mm
RoHS Status RoHS Compliant
Просмотр сходства

BDN16-3CB/A01 Документы

BDN16-3CB/A01 brand manufacturers: CTS Thermal Management Products, Anli stock, BDN16-3CB/A01 reference price.CTS Thermal Management Products. BDN16-3CB/A01 parameters, BDN16-3CB/A01 Datasheet PDF and pin diagram description download.You can use the BDN16-3CB/A01 Thermal - Heat Sinks, DSP Datesheet PDF, find BDN16-3CB/A01 pin diagram and circuit diagram and usage method of function,BDN16-3CB/A01 electronics tutorials.You can download from the Anli.