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HSB02-101007 Технические параметры

CUI Devices  HSB02-101007 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Thermal - Heat Sinks
Марка CUI Devices
Material Aluminum Alloy
Shape Square, Pin Fins
Package Cooled BGA
Material Finish Black Anodized
Designed for BGA
Mounting Styles Adhesive
Heatsink Material Aluminum Alloy
Fin Style Vertical Fin
Factory Pack QuantityFactory Pack Quantity 3672
Package Box
Mfr CUI Devices
Product Status Active
Свойство продукта Значение свойства
Series HSB
Type Top Mount
Color Black
Attachment Method Adhesive
Thermal Resistance @ Forced Air Flow 16.50°C/W @ 200 LFM
Thermal Resistance @ Natural 37.90°C/W
Power Dissipation @ Temperature Rise 2.0W @ 75°C
Product Heatsinks
Thermal Resistance 41.9 C/W
Length 10 mm
Width 10 mm
Height 7 mm
Diameter -
Просмотр сходства
HSB02-101007 brand manufacturers: CUI Devices, Anli stock, HSB02-101007 reference price.CUI Devices. HSB02-101007 parameters, HSB02-101007 Datasheet PDF and pin diagram description download.You can use the HSB02-101007 Thermal - Heat Sinks, DSP Datesheet PDF, find HSB02-101007 pin diagram and circuit diagram and usage method of function,HSB02-101007 electronics tutorials.You can download from the Anli.