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HSB08-212106 Технические параметры

CUI Devices  HSB08-212106 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Thermal - Heat Sinks
Марка CUI Devices
Material Aluminum Alloy
Shape Square, Pin Fins
Package Cooled BGA
Material Finish Black Anodized
Factory Pack QuantityFactory Pack Quantity 1872
Fin Style Vertical Fin
Heatsink Material Aluminum Alloy
Mounting Styles Adhesive
Designed for BGA
Package Box
Mfr CUI Devices
Product Status Active
Свойство продукта Значение свойства
Series HSB
Type Top Mount
Color Black
Attachment Method Adhesive
Thermal Resistance @ Forced Air Flow 9.70°C/W @ 200 LFM
Thermal Resistance @ Natural 25.40°C/W
Power Dissipation @ Temperature Rise 3.0W @ 75°C
Product Heatsinks
Thermal Resistance 31.2 C/W
Height 6 mm
Width 21 mm
Length 21 mm
Diameter -
Просмотр сходства
HSB08-212106 brand manufacturers: CUI Devices, Anli stock, HSB08-212106 reference price.CUI Devices. HSB08-212106 parameters, HSB08-212106 Datasheet PDF and pin diagram description download.You can use the HSB08-212106 Thermal - Heat Sinks, DSP Datesheet PDF, find HSB08-212106 pin diagram and circuit diagram and usage method of function,HSB08-212106 electronics tutorials.You can download from the Anli.