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HSB12-272706 Технические параметры

CUI Devices  HSB12-272706 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Thermal - Heat Sinks
Марка CUI Devices
Material Aluminum Alloy
Shape Square, Pin Fins
Package Cooled BGA
Material Finish Black Anodized
Designed for BGA
Mounting Styles Adhesive
Heatsink Material Aluminum Alloy
Fin Style Vertical Fin
Factory Pack QuantityFactory Pack Quantity 1540
Package Box
Mfr CUI Devices
Product Status Active
Свойство продукта Значение свойства
Series HSB
Type Top Mount
Color Black
Attachment Method Adhesive
Thermal Resistance @ Forced Air Flow 7.80°C/W @ 200 LFM
Thermal Resistance @ Natural 19.59°C/W
Power Dissipation @ Temperature Rise 3.8W @ 75°C
Product Heatsinks
Thermal Resistance 22.5 C/W
Length 27 mm
Width 27 mm
Height 6 mm
Diameter -
Просмотр сходства
HSB12-272706 brand manufacturers: CUI Devices, Anli stock, HSB12-272706 reference price.CUI Devices. HSB12-272706 parameters, HSB12-272706 Datasheet PDF and pin diagram description download.You can use the HSB12-272706 Thermal - Heat Sinks, DSP Datesheet PDF, find HSB12-272706 pin diagram and circuit diagram and usage method of function,HSB12-272706 electronics tutorials.You can download from the Anli.