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HSB13-303014 Технические параметры

CUI Devices  HSB13-303014 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Thermal - Heat Sinks
Марка CUI Devices
Material Aluminum Alloy
Shape Square, Pin Fins
Package Cooled BGA
Material Finish Black Anodized
Designed for BGA
Mounting Styles Adhesive
Heatsink Material Aluminum Alloy
Fin Style Vertical Fin
Factory Pack QuantityFactory Pack Quantity 1440
Package Box
Mfr CUI Devices
Product Status Active
Свойство продукта Значение свойства
Series HSB
Type Top Mount
Color Black
Attachment Method Adhesive
Thermal Resistance @ Forced Air Flow 4.70°C/W @ 200 LFM
Thermal Resistance @ Natural 12.36°C/W
Power Dissipation @ Temperature Rise 6.1W @ 75°C
Product Heatsinks
Thermal Resistance 14.8 C/W
Length 30.7 mm
Width 30.7 mm
Height 14.1 mm
Diameter -
Просмотр сходства
HSB13-303014 brand manufacturers: CUI Devices, Anli stock, HSB13-303014 reference price.CUI Devices. HSB13-303014 parameters, HSB13-303014 Datasheet PDF and pin diagram description download.You can use the HSB13-303014 Thermal - Heat Sinks, DSP Datesheet PDF, find HSB13-303014 pin diagram and circuit diagram and usage method of function,HSB13-303014 electronics tutorials.You can download from the Anli.