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HSB14-353518 Технические параметры

CUI Devices  HSB14-353518 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Thermal - Heat Sinks
Марка CUI Devices
Material Aluminum Alloy
Shape Square, Pin Fins
Package Cooled BGA
Material Finish Black Anodized
Designed for BGA
Mounting Styles Adhesive
Heatsink Material Aluminum Alloy
Fin Style Vertical Fin
Factory Pack QuantityFactory Pack Quantity 1280
Package Box
Mfr CUI Devices
Product Status Active
Свойство продукта Значение свойства
Series HSB
Type Top Mount
Color Black
Attachment Method Adhesive
Thermal Resistance @ Forced Air Flow 3.60°C/W @ 200 LFM
Thermal Resistance @ Natural 8.97°C/W
Power Dissipation @ Temperature Rise 8.4W @ 75°C
Product Heatsinks
Thermal Resistance 12.7 C/W
Length 35 mm
Width 35 mm
Height 18 mm
Diameter -
Просмотр сходства
HSB14-353518 brand manufacturers: CUI Devices, Anli stock, HSB14-353518 reference price.CUI Devices. HSB14-353518 parameters, HSB14-353518 Datasheet PDF and pin diagram description download.You can use the HSB14-353518 Thermal - Heat Sinks, DSP Datesheet PDF, find HSB14-353518 pin diagram and circuit diagram and usage method of function,HSB14-353518 electronics tutorials.You can download from the Anli.