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HSB16-404018 Технические параметры

CUI Devices  HSB16-404018 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Thermal - Heat Sinks
Марка CUI Devices
Material Aluminum Alloy
Shape Square, Pin Fins
Package Cooled BGA
Material Finish Black Anodized
Designed for BGA
Mounting Styles Adhesive
Heatsink Material Aluminum Alloy
Fin Style Vertical Fin
Factory Pack QuantityFactory Pack Quantity 1280
Package Box
Mfr CUI Devices
Product Status Active
Свойство продукта Значение свойства
Series HSB
Type Top Mount
Color Black
Attachment Method Adhesive
Thermal Resistance @ Forced Air Flow 2.60°C/W @ 200 LFM
Thermal Resistance @ Natural 7.96°C/W
Power Dissipation @ Temperature Rise 9.4W @ 75°C
Product Heatsinks
Thermal Resistance 11.1 C/W
Length 40 mm
Width 40 mm
Height 18 mm
Diameter -
Просмотр сходства
HSB16-404018 brand manufacturers: CUI Devices, Anli stock, HSB16-404018 reference price.CUI Devices. HSB16-404018 parameters, HSB16-404018 Datasheet PDF and pin diagram description download.You can use the HSB16-404018 Thermal - Heat Sinks, DSP Datesheet PDF, find HSB16-404018 pin diagram and circuit diagram and usage method of function,HSB16-404018 electronics tutorials.You can download from the Anli.