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HSB17-404025 Технические параметры

CUI Devices  HSB17-404025 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Thermal - Heat Sinks
Марка CUI Devices
Material Aluminum Alloy
Shape Square, Pin Fins
Package Cooled BGA
Material Finish Black Anodized
Designed for BGA
Mounting Styles Adhesive
Heatsink Material Aluminum Alloy
Fin Style Vertical Fin
Factory Pack QuantityFactory Pack Quantity 1280
Package Box
Mfr CUI Devices
Product Status Active
Свойство продукта Значение свойства
Series HSB
Type Top Mount
Color Black
Attachment Method Adhesive
Thermal Resistance @ Forced Air Flow 2.10°C/W @ 200 LFM
Thermal Resistance @ Natural 6.41°C/W
Power Dissipation @ Temperature Rise 11.7W @ 75°C
Product Heatsinks
Thermal Resistance 9 C/W
Length 40 mm
Width 40 mm
Height 25 mm
Diameter -
Просмотр сходства
HSB17-404025 brand manufacturers: CUI Devices, Anli stock, HSB17-404025 reference price.CUI Devices. HSB17-404025 parameters, HSB17-404025 Datasheet PDF and pin diagram description download.You can use the HSB17-404025 Thermal - Heat Sinks, DSP Datesheet PDF, find HSB17-404025 pin diagram and circuit diagram and usage method of function,HSB17-404025 electronics tutorials.You can download from the Anli.