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HSB18-232310 Технические параметры

CUI Devices  HSB18-232310 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Thermal - Heat Sinks
Марка CUI Devices
Material Aluminum Alloy
Shape Square, Pin Fins
Package Cooled BGA
Material Finish Black Anodized
Designed for BGA
Mounting Styles Adhesive
Heatsink Material Aluminum Alloy
Fin Style Vertical Fin
Factory Pack QuantityFactory Pack Quantity 1872
Package Box
Mfr CUI Devices
Product Status Active
Свойство продукта Значение свойства
Series HSB
Type Top Mount
Color Black
Attachment Method Adhesive
Thermal Resistance @ Forced Air Flow 6.80°C/W @ 200 LFM
Thermal Resistance @ Natural 20.41°C/W
Power Dissipation @ Temperature Rise 3.7W @ 75°C
Product Heatsinks
Thermal Resistance 24 C/W
Length 23 mm
Width 23 mm
Height 10 mm
Diameter -
Просмотр сходства
HSB18-232310 brand manufacturers: CUI Devices, Anli stock, HSB18-232310 reference price.CUI Devices. HSB18-232310 parameters, HSB18-232310 Datasheet PDF and pin diagram description download.You can use the HSB18-232310 Thermal - Heat Sinks, DSP Datesheet PDF, find HSB18-232310 pin diagram and circuit diagram and usage method of function,HSB18-232310 electronics tutorials.You can download from the Anli.