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HSB20-353525 Технические параметры

CUI Devices  HSB20-353525 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Thermal - Heat Sinks
Марка CUI Devices
Material Aluminum Alloy
Shape Square, Pin Fins
Package Cooled BGA
Material Finish Black Anodized
Package Box
Mfr CUI Devices
Product Status Active
Mounting Styles Adhesive
Heatsink Material Aluminum Alloy
Designed for BGA
Fin Style Vertical Fin
Свойство продукта Значение свойства
Series HSB
Type Top Mount
Attachment Method Adhesive
Thermal Resistance @ Forced Air Flow 2.70°C/W @ 200 LFM
Thermal Resistance @ Natural 6.65°C/W
Power Dissipation @ Temperature Rise 11.3W @ 75°C
Product Heat Sinks
Thermal Resistance 9.9 C/W
Width 1.378 (35.00mm)
Length 1.378 (35.00mm)
Diameter -
Height 25 mm
Просмотр сходства
HSB20-353525 brand manufacturers: CUI Devices, Anli stock, HSB20-353525 reference price.CUI Devices. HSB20-353525 parameters, HSB20-353525 Datasheet PDF and pin diagram description download.You can use the HSB20-353525 Thermal - Heat Sinks, DSP Datesheet PDF, find HSB20-353525 pin diagram and circuit diagram and usage method of function,HSB20-353525 electronics tutorials.You can download from the Anli.