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HSB22-606010 Технические параметры

CUI Devices  HSB22-606010 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Thermal - Heat Sinks
Марка CUI Devices
Material Aluminum
Shape Square, Pin Fins
Package Cooled BGA
Material Finish Black Anodized
Package Box
Mfr CUI Devices
Product Status Active
Mounting Styles Adhesive
Heatsink Material Aluminum Alloy
Designed for BGA
Fin Style Vertical Fin
Свойство продукта Значение свойства
Series HSB
Type Top Mount
Attachment Method Adhesive
Thermal Resistance @ Forced Air Flow 2.60°C/W @ 200 LFM
Thermal Resistance @ Natural 7.62°C/W
Power Dissipation @ Temperature Rise 9.8W @ 75°C
Product Heat Sinks
Thermal Resistance 10.1 C/W
Width 2.362 (60.00mm)
Length 2.362 (60.00mm)
Diameter -
Height 10 mm
Просмотр сходства
HSB22-606010 brand manufacturers: CUI Devices, Anli stock, HSB22-606010 reference price.CUI Devices. HSB22-606010 parameters, HSB22-606010 Datasheet PDF and pin diagram description download.You can use the HSB22-606010 Thermal - Heat Sinks, DSP Datesheet PDF, find HSB22-606010 pin diagram and circuit diagram and usage method of function,HSB22-606010 electronics tutorials.You can download from the Anli.