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HSB23-232325 Технические параметры

CUI Devices  HSB23-232325 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Thermal - Heat Sinks
Марка CUI Devices
Material Aluminum Alloy
Shape Square, Pin Fins
Package Cooled BGA
Material Finish Black Anodized
RoHS Details
Designed for BGA
Mounting Styles Adhesive
Heatsink Material Aluminum
Fin Style Vertical Fin
Package Box
Mfr CUI Devices
Product Status Active
Свойство продукта Значение свойства
Series HSB
Type BGA Heatsink
Color Black
Attachment Method Adhesive
Thermal Resistance @ Forced Air Flow 3.80°C/W @ 200 LFM
Thermal Resistance @ Natural 12.23°C/W
Power Dissipation @ Temperature Rise 6.13W @ 75°C
Product Heatsinks
Thermal Resistance 16.1 C/W
Length 23 mm
Width 23 mm
Height 25 mm
Diameter -
Просмотр сходства
HSB23-232325 brand manufacturers: CUI Devices, Anli stock, HSB23-232325 reference price.CUI Devices. HSB23-232325 parameters, HSB23-232325 Datasheet PDF and pin diagram description download.You can use the HSB23-232325 Thermal - Heat Sinks, DSP Datesheet PDF, find HSB23-232325 pin diagram and circuit diagram and usage method of function,HSB23-232325 electronics tutorials.You can download from the Anli.