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HSB24-252510 Технические параметры

CUI Devices  HSB24-252510 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Thermal - Heat Sinks
Марка CUI Devices
Material Aluminum Alloy
Shape Square, Pin Fins
Package Cooled BGA
Material Finish Black Anodized
RoHS Details
Designed for BGA
Mounting Styles Adhesive
Heatsink Material Aluminum
Fin Style Vertical Fin
Package Box
Mfr CUI Devices
Product Status Active
Свойство продукта Значение свойства
Series HSB
Type BGA Heatsink
Color Black
Attachment Method Adhesive
Thermal Resistance @ Forced Air Flow 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural 18.10°C/W
Power Dissipation @ Temperature Rise 4.14W @ 75°C
Product Heatsinks
Thermal Resistance 21.3 C/W
Length 25 mm
Width 25 mm
Height 10 mm
Diameter -
Просмотр сходства
HSB24-252510 brand manufacturers: CUI Devices, Anli stock, HSB24-252510 reference price.CUI Devices. HSB24-252510 parameters, HSB24-252510 Datasheet PDF and pin diagram description download.You can use the HSB24-252510 Thermal - Heat Sinks, DSP Datesheet PDF, find HSB24-252510 pin diagram and circuit diagram and usage method of function,HSB24-252510 electronics tutorials.You can download from the Anli.