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HSB37-404023 Технические параметры

CUI Devices  HSB37-404023 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Thermal - Heat Sinks
Марка CUI Devices
Material Aluminum Alloy
Shape Square, Pin Fins
Package Cooled BGA
Material Finish Black Anodized
Mfr CUI Devices
Fin Height 0.905" (23.00mm)
Series HSB
Свойство продукта Значение свойства
Packaging Box
Part Status Active
Type Top Mount
Attachment Method Adhesive (Not Included)
Thermal Resistance @ Forced Air Flow 2.10°C/W @ 200 LFM
Thermal Resistance @ Natural 6.43°C/W
Power Dissipation @ Temperature Rise 11.7W @ 75°C
Length 1.575" (40.00mm)
Width 1.575" (40.00mm)
Просмотр сходства

HSB37-404023 Документы

HSB37-404023 brand manufacturers: CUI Devices, Anli stock, HSB37-404023 reference price.CUI Devices. HSB37-404023 parameters, HSB37-404023 Datasheet PDF and pin diagram description download.You can use the HSB37-404023 Thermal - Heat Sinks, DSP Datesheet PDF, find HSB37-404023 pin diagram and circuit diagram and usage method of function,HSB37-404023 electronics tutorials.You can download from the Anli.