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HSE04-251265-2 Технические параметры

CUI Devices  HSE04-251265-2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Thermal - Heat Sinks
Марка CUI Devices
Material Aluminum Alloy
Shape Rectangular, Fins
Package Cooled TO-218, TO-220
Material Finish Black Anodized
RoHS Details
Designed for TO-220, TO-218
Mounting Styles PCB
Heatsink Material Aluminum
Fin Style Extruded Radial Fin
Package Bag
Mfr CUI Devices
Product Status Active
Свойство продукта Значение свойства
Series HSE
Type Extruded Heatsink
Color Black
Attachment Method Bolt On
Thermal Resistance @ Forced Air Flow 16.60°C/W @ 200 LFM
Thermal Resistance @ Natural 30.38°C/W
Power Dissipation @ Temperature Rise 2.47W @ 75°C
Product Heatsinks
Thermal Resistance 34.4 C/W
Length 25 mm
Width 12 mm
Height 6.5 mm
Diameter -
Просмотр сходства
HSE04-251265-2 brand manufacturers: CUI Devices, Anli stock, HSE04-251265-2 reference price.CUI Devices. HSE04-251265-2 parameters, HSE04-251265-2 Datasheet PDF and pin diagram description download.You can use the HSE04-251265-2 Thermal - Heat Sinks, DSP Datesheet PDF, find HSE04-251265-2 pin diagram and circuit diagram and usage method of function,HSE04-251265-2 electronics tutorials.You can download from the Anli.