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HSS08-B18-CP Технические параметры

CUI Devices  HSS08-B18-CP technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Thermal - Heat Sinks
Марка CUI Devices
Material Aluminum Alloy
Shape Square
Package Cooled TO-218
Material Finish Black Anodized
Designed for TO-218
Mounting Styles PCB Mount
Heatsink Material Aluminum Alloy
Fin Style Formed Fin
Factory Pack QuantityFactory Pack Quantity 1000
Package Box
Mfr CUI Devices
Product Status Active
Свойство продукта Значение свойства
Series HSS
Type Board Level, Vertical
Color Black
Attachment Method PC Pin
Thermal Resistance @ Forced Air Flow 3.50°C/W @ 200 LFM
Thermal Resistance @ Natural 7.29°C/W
Power Dissipation @ Temperature Rise 10.3W @ 75°C
Product Heatsinks
Thermal Resistance 9.7 C/W
Length 44.45 mm
Width 44.45 mm
Height 12.5 mm
Diameter -
Просмотр сходства
HSS08-B18-CP brand manufacturers: CUI Devices, Anli stock, HSS08-B18-CP reference price.CUI Devices. HSS08-B18-CP parameters, HSS08-B18-CP Datasheet PDF and pin diagram description download.You can use the HSS08-B18-CP Thermal - Heat Sinks, DSP Datesheet PDF, find HSS08-B18-CP pin diagram and circuit diagram and usage method of function,HSS08-B18-CP electronics tutorials.You can download from the Anli.