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HSS19-B20-NP Технические параметры

CUI Devices  HSS19-B20-NP technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Thermal - Heat Sinks
Марка CUI Devices
Material Aluminum Alloy
Shape Rectangular, Fins
Package Cooled TO-218, TO-220
Material Finish Black Anodized
RoHS Details
Designed for TO-220
Mounting Styles PCB
Heatsink Material Aluminum
Fin Style Straight Fin
Package Bag
Mfr CUI Devices
Product Status Active
Свойство продукта Значение свойства
Series HSS
Type Stamped Heatsink
Color Black
Attachment Method Bolt On
Thermal Resistance @ Forced Air Flow 8.80°C/W @ 200 LFM
Thermal Resistance @ Natural 22.39°C/W
Power Dissipation @ Temperature Rise 3.35W @ 75°C
Product Heatsinks
Thermal Resistance 26.6 C/W
Length 22 mm
Width 19 mm
Height 19 mm
Diameter -
Просмотр сходства
HSS19-B20-NP brand manufacturers: CUI Devices, Anli stock, HSS19-B20-NP reference price.CUI Devices. HSS19-B20-NP parameters, HSS19-B20-NP Datasheet PDF and pin diagram description download.You can use the HSS19-B20-NP Thermal - Heat Sinks, DSP Datesheet PDF, find HSS19-B20-NP pin diagram and circuit diagram and usage method of function,HSS19-B20-NP electronics tutorials.You can download from the Anli.