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HSS23-B20-NP Технические параметры

CUI Devices  HSS23-B20-NP technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Thermal - Heat Sinks
Марка CUI Devices
Material Aluminum Alloy
Shape Rectangular, Fins
Package Cooled TO-218, TO-220
Material Finish Black Anodized
RoHS Details
Designed for TO-220
Mounting Styles PCB
Heatsink Material Aluminum
Fin Style Twisted Fin
Package Box
Mfr CUI Devices
Product Status Active
Свойство продукта Значение свойства
Series HSS
Type Stamped Heatsink
Color Black
Attachment Method Bolt On
Thermal Resistance @ Forced Air Flow 5.00°C/W @ 200 LFM
Thermal Resistance @ Natural 10.19°C/W
Power Dissipation @ Temperature Rise 7.36W @ 75°C
Product Heatsinks
Thermal Resistance 13.4 C/W
Length 42 mm
Width 38 mm
Height 20 mm
Diameter -
Просмотр сходства
HSS23-B20-NP brand manufacturers: CUI Devices, Anli stock, HSS23-B20-NP reference price.CUI Devices. HSS23-B20-NP parameters, HSS23-B20-NP Datasheet PDF and pin diagram description download.You can use the HSS23-B20-NP Thermal - Heat Sinks, DSP Datesheet PDF, find HSS23-B20-NP pin diagram and circuit diagram and usage method of function,HSS23-B20-NP electronics tutorials.You can download from the Anli.