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- CY7C026AV-25AXC
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CY7C026AV-25AXC Технические параметры
Cypress Semiconductor Corp CY7C026AV-25AXC technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory | |
| Марка | ||
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 100-LQFP | |
| Number of Pins | 100Pins | |
| Memory Types | Volatile | |
| Operating Temperature | 0°C~70°C TA | |
| Packaging | Tray | |
| Published | 2003 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 100Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | MATTE TIN | |
| Additional Feature | FLOW-THROUGH | |
| Voltage - Supply | 3V~3.6V | |
| Terminal Position | QUAD | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Supply Voltage | 3.3V | |
| Terminal Pitch | 0.5mm | |
| Frequency | 25GHz | |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Base Part Number | CY7C026 | |
| Pin Count | 100 | |
| Operating Supply Voltage | 3.3V | |
| Supply Voltage-Max (Vsup) | 3.6V | |
| Supply Voltage-Min (Vsup) | 3V | |
| Memory Size | 256Kb 16K x 16 | |
| Number of Ports | 2Ports | |
| Nominal Supply Current | 165mA | |
| Memory Format | SRAM | |
| Memory Interface | Parallel | |
| Organization | 16KX16 | |
| Output Characteristics | 3-STATE | |
| Memory Width | 16 | |
| Write Cycle Time - Word, Page | 25ns | |
| Address Bus Width | 28b | |
| Density | 256 kb | |
| Standby Current-Max | 0.00005A | |
| I/O Type | COMMON | |
| Sync/Async | Asynchronous | |
| Word Size | 16b | |
| Standby Voltage-Min | 2V | |
| Length | 14mm | |
| Height Seated (Max) | 1.6mm | |
| RoHS Status | ROHS3 Compliant | |
| Radiation Hardening | No | |
| Lead Free | Lead Free |
CY7C026AV-25AXC Документы
- DatasheetsCY7C024AV,BV,025AV,026AV
- PCN Obsolescence/ EOLMult Dev EOL 30/Jan/2018
- PCN PackagingShip Label/Document Standardization 24/Jan/2018 Mult Devices 19/Jul/2017
- Environmental InformationRoHS3 Certificate
- PCN Design/SpecificationCopper Bond Wire 31/Jul/2014
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