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FM24W256-G Технические параметры
Cypress Semiconductor Corp FM24W256-G technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory | |
| Марка | ||
| Factory Lead Time | 6 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 8-SOIC (0.154, 3.90mm Width) | |
| Number of Pins | 8Pins | |
| Weight | 540.001716mg | |
| Memory Types | Non-Volatile | |
| Operating Temperature | -40°C~85°C TA | |
| Packaging | Tube | |
| Series | F-RAM™ | |
| Published | 2008 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 8Terminations | |
| ECCN Code | EAR99 | |
| Voltage - Supply | 2.7V~5.5V | |
| Terminal Position | DUAL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Supply Voltage | 3.3V | |
| Terminal Pitch | 1.27mm | |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Base Part Number | FM24W256 | |
| Pin Count | 8 | |
| Operating Supply Voltage | 3.3V | |
| Supply Voltage-Max (Vsup) | 5.5V | |
| Power Supplies | 3/5V | |
| Supply Voltage-Min (Vsup) | 2.7V | |
| Interface | 2-Wire, I2C | |
| Memory Size | 256Kb 32K x 8 | |
| Nominal Supply Current | 400μA | |
| Clock Frequency | 1MHz | |
| Access Time | 550ns | |
| Memory Format | FRAM | |
| Memory Interface | I2C | |
| Data Bus Width | 8b | |
| Density | 256 kb | |
| Standby Current-Max | 0.00003A | |
| Word Size | 8b | |
| Ambient Temperature Range High | 85°C | |
| Height | 1.727mm | |
| Length | 4.98mm | |
| Width | 3.987mm | |
| REACH SVHC | No SVHC | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
FM24W256-G Документы
- DatasheetsFM24W256
- PCN Design/SpecificationDatasheet Update 27/Feb/2014 F-FRAM Marking Changes 30/Aug/2013
- PCN PackagingShip Label/Document Standardization 24/Jan/2018
- PCN Assembly/OriginQualification Passivation Layer 22/Mar/2014
- PCN OtherMSL Standardization 15/Dec/2014
- Environmental InformationRoHS3 Certificate
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