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DDZ6V2BS-7 Технические параметры
Diodes Incorporated DDZ6V2BS-7 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Diodes - Zener - Single | |
| Марка | ||
| Factory Lead Time | 19 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | SC-76, SOD-323 | |
| Number of Pins | 2Pins | |
| Weight | 4.904468mg | |
| Diode Element Material | SILICON | |
| Number of Elements | 1 Element | |
| Operating Temperature | -65°C~150°C | |
| Packaging | Tape & Reel (TR) | |
| Published | 2008 | |
| Tolerance | ±2.54% | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 2Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | Matte Tin (Sn) | |
| HTS Code | 8541.10.00.50 | |
| Power Rating | 200mW | |
| Max Power Dissipation | 200mW | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Base Part Number | DDZ6V2 | |
| Pin Count | 2 | |
| Polarity | UNIDIRECTIONAL | |
| Impedance | 7Ohm | |
| Element Configuration | Single | |
| Diode Type | ZENER DIODE | |
| Current - Reverse Leakage @ Vr | 500nA @ 4V | |
| Power Dissipation | 200mW | |
| Voltage - Forward (Vf) (Max) @ If | 900mV @ 10mA | |
| Max Reverse Leakage Current | 500nA | |
| Impedance-Max | 7Ohm | |
| Test Current | 20mA | |
| Reference Voltage | 6.2V | |
| Forward Voltage | 900mV | |
| Zener Voltage | 6.2V | |
| Peak Reverse Current | 500nA | |
| Voltage Tolerance | 2.535% | |
| Zener Current | 500nA | |
| Height | 1.05mm | |
| Length | 2.5mm | |
| Width | 1.3mm | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant |
DDZ6V2BS-7 Документы
- Environmental InformationDiodes RoHS 3 Cert
- DatasheetsDDZ5V1BS - DDZ43S
- PCN Assembly/OriginMult Dev Wafer Source Chgs 9/Mar/2018
- PCN OtherMultiple Device Changes 29/Apr/2013
- PCN Design/SpecificationGreen Encapsulate 29/Aug/2008 Bond Wire 3/May/2011
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